SEAKR Licenses Kandou Technology for Space Applications

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31.10.2019
Space

SEAKR’s solutions require extreme performance density per watt or kilogram for the unique challenges of deployment and ongoing operation of space-based communications. Kandou’s technology is a perfect match as it delivers high bandwidth signaling at very low power allowing power savings especially critical for aerospace and satellite communications.

Kandou Bus announced today that their Glasswing chip-to-chip link technology has been licensed by SEAKR Engineering for use in a variety of future multi-chip products.  Based on Kandou’s CNRZ-5 Chord signaling architecture, the Glasswing SerDes delivers high bandwidth signaling at very low power and is ideally suited for short links inside a shared package.  The Glasswing SerDes is the world’s first and only USR SerDes proven in silicon and capable of delivering 1Tbps bandwidth at under one watt, paving the way for fundamental architectural shifts in power savings especially critical in aerospace and satellite communications.

“SEAKR is the industry leader in providing advanced electronics for space applications,” said Amin Shokrollahi, Founder and CEO of Kandou.  “The Glasswing transceiver is a proven USR SerDes that is already shipping in production volumes with other customers and we’re delighted that SEAKR recognizes the value of our innovations and technology.”

“Our solutions require extreme performance density per watt or kilogram for the unique challenges of deployment and ongoing operation of space-based communications,” said Tony Lowry, ASIC Program Manager at SEAKR. “The Glasswing IP provides a robust, high-speed interconnect with ultra-low power consumption that is relatively straightforward to implement, making it ideal for our products. Glasswing technology is designed to facilitate the combination of multiple chips in a single package. By eliminating the need for a silicon interposer to implement Glasswing IP interconnect, we lower risk and costs and enable system optimizations using standard organic substrate design practices.” 

The Glasswing hard IP delivers a total of 500Gbps of bi-directional throughput on just 2.4mm of die edge while consuming only 1pJ/bit. The link achieves a native BER of better than 1E-15 at the targeted data rate of 25GBaud. An optional FEC can improve the BER to 1E-28, providing further design margin.  Insertion loss is specified up to 6dB at 25GBaud, enabling channels of up to 40mm on standard, low cost, organic substrates.

(Press release)

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