Kandou’s connectivity IP and chip solutions increase link data throughput and reduce power consumption. The investment will be used to scale all aspects of Kandou’s operations and to expand the development and deployment of its high speed, low power interconnect devices.
Founded in 2011, Kandou’s most recent technical achievement was the design and introduction of the Glasswing Ultra-Short Reach SerDes, the first and only technology that delivers one Tbps of throughput at just one Watt of power consumption. Terabytes per second (TBps) refers to a data transmission rate equivalent to 1,000 gigabytes per second. The fabless semiconductor company will begin leveraging many of the innovations in its IP portfolio to launch a series of high speed, low power interconnect products for consumer and networking applications.
“High speed connectivity inside and between devices is one of the biggest challenges the electronics industry is facing. We appreciate the confidence that our investors have shown in our ability to innovate, build, and deliver world-class solutions to this challenge,” said Amin Shokrollahi, Founder and CEO of Kandou. “We are rapidly expanding our IP footprint in the industry, and we will soon be shipping our first chips designed for the upcoming generation of USB interconnect in consumer devices. This round of funding ensures that we deliver.”
“Bessemer is delighted to participate in another investment round with Kandou as it goes to market with technology that will make profound advancements in communications between consumer electronic devices,” said Felda Hardymon, Partner at Bessemer Venture Partners. “Kandou continues to demonstrate and deliver industry leading technologies that provide a path for enhanced electronic products for several generations. We are excited to see Kandou’s innovations come to the market.”
“Kandou’s innovative signaling techniques and circuit implementations demonstrate unprecedented increases in link data throughput and reductions in power consumption,” said Pär Lange, Investment Partner at Swisscom Ventures. “Major industry players have taken notice and we are pleased to support Kandou in this next step of growth.”
“Creating power efficient, high speed chip-to-chip communication solutions is the mainstay for Kandou,” said Frederic Wohlwend, Managing Director at Forestay Capital. “Their disruptive technology and unique approach to solving interconnect issues, along with their track record of product execution, presented a compelling reason for us to invest.”
The complete list of institutional and strategic investors in the Series C round is: Bessemer Venture Partners, Columbia Lake Partners, Digital Transformation Fund, Fayerweather Capital Partners, Forestay Capital, Kreos Capital, Raging Capital, Swisscom Ventures, and Walden International.
(Press release)Picture: Kandou
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