Kandou achieves broad customer adoption

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21.06.2022
Kandou Matterhorn

The Matterhorn USB-C retimer with USB4 support has been deployed in products from five of the top six PC OEMs. These products, the first of which recently received USB4 compliance certification, include laptops and mobile computing devices sold worldwide by companies in the U.S., China, Japan and Taiwan. The retimer secures the signal integrity of high-speed chip-to-chip links. 

Kandou’s Matterhorn solutions follow the USB Implementers Forum (USB-IF) specification for USB4 and support long reach with no compromise on signal integrity to give system designers enhanced flexibility in system development and USB4 implementation. Improved user experiences include enhanced display graphics, faster data transfer between USB4-connected devices and improved battery life of mobile products.

Matterhorn is the only commercially available USB4 retimer to work across all system-on-chip (SoC) platforms. It is also being implemented in designs that will be deployed in desktop and gaming platforms available to consumers later this year.

“The adoption of Matterhorn, named for the mountain in the Alps, by five of the six top PC OEMs (original equipment manufacturers) reinforces the incredible accomplishment by everyone at Kandou,” comments Amin Shokrollahi, Founder and CEO of Kandou. “We managed our ascent through a global pandemic and successfully delivered a chip sought after by some of the most discerning electronics manufacturers.”

Founded in 2011 in Lausanne with offices in Europe, North America and Asia, Kandou Bus SA is a fabless semiconductor company that has established itself as an innovative leader in high-speed, energy-efficient chip-to-chip link solutions. It enables a better-connected world by offering disruptive technology through licensing and standard products for smaller, more energy efficient and cost-effective electronic devices. Kandou offers fundamental advances in interconnect technology that lower power consumption and improve the performance of chip links, unlocking new capabilities for customer devices and systems.

(Press release/RAN)

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