Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions based in Lausanne, closed its Series D round of funding, resulting in $75 million raised in the round. The investment supports the ramp-up of Kandou’s first silicon product and the ongoing development of its signalling technology.
Proceeds from Series D will be used to ramp production of Kandou’s first silicon product known as Matterhorn, a USB-C multiprotocol retimer solution with USB4 support for consumer and networking applications for electronic devices. Funds also will be used for ongoing development of product and technology roadmaps, including new silicon products and Chord signaling intellectual property (IP) for ultra-short reach and long-reach signaling applications.
“This round of funding will enable us to meet the demand for Matterhorn from customers while we continue to innovate and deliver high-speed connectivity solutions,” remarks Amin Shokrollahi, Founder and CEO of Kandou. “We thank Bessemer Venture Partners for their ongoing commitment to us and welcome new Kandou investors participating in this round.” The total investment in Kandou to date is $207.8 million from new and existing investors including Bessemer Venture Partners and DC Investment Partners.
Based on fundamental advances in interconnect technology that lower power consumption and improve the performance of chip links, Kandou offers disruptive technology through licensing and standard products for smaller, more energy efficient and cost-effective electronic devices. Kandou is a fabless semiconductor company founded in 2011 and headquartered in Lausanne, Switzerland, with offices in Europe, North America and Asia.
(Press release / SK)
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