Miraex obtains financial support to bring its photonic sensing into mass manufacturing

As a pioneer in photonic sensing solutions, Miraex develops, manufactures and offers photonic and quantum solutions for sensing, networking and computing. Industrial sensing solutions prevent asset failure before it happens in the most demanding environments, where standard electronic sensors do not work.

The new Innosuisse-Embrapii project will address two fronts simultaneously: the co-design of an Application-Specific Integrated Circuit (ASIC) with a custom Photonic Integrated Circuit (PIC). On the one hand, the ASIC chip will be specifically designed to enable both extreme sensitivity requirements and aerospace-grade temperature range and reliability. The project will output a production-ready chip, ready for mass manufacturing.

On the other hand, Miraex will develop a PIC that integrates light sources, modulators, filters, and detectors at high density. Instead of electricity, photonic integrated circuits work with light (photons), this makes them more accurate and faster but also more economical and reliable than conventional chips, offering light-speed super energy-efficient data processing. The miniaturized edge controller will be compatible with all Miraex sensors and provide ultra-compact packaging similar to SFP telecom transceivers.

With the funds and support from its collaboration partners, Miraex will be able to reduce its edge controller size and production cost to reach the volumes necessary to address markets such as aerospace, industry 4.0 and automotive with digital sensing solutions. The same technology platform is also at the heart of Miraex quantum sensing and networking products.

(Press release/RAN)

Picture: Highly miniaturized edge controller comprising Photonics Integrated Circuit (PIC) and Application-Specific Integrated Circuit (ASIC) chips (Source : Juniper Networks / MiraEx)